What is Vfqfn?

Quad (VFQFN) and dual in line (PowerFLAT™) are very low space occupancy, lead-less packages with enhanced thermal performances.

What is QFP and QFN?

The most common IC package types for larger critical components such as microcontrollers are the QFP (Quad Flat Package) and QFN (Quad Flat No-leads) packages. The need for X-Ray Inspection increases the cost of assembly for QFN parts compared to their QFP counterparts.

What are the different IC packages?

What is IC packaging?

DIP (Double In-line Package)
SOP/SOIC/SO (Small Outline Package)
QFP (Quad Flat Package)
QFN/LCC (Quad Flat Non-leaded Package)
BGA (Ball Grid Array Package)
CSP (Chip Scale Package)

What are IC packages made of?

The materials of the package are either plastic (thermoset or thermoplastic), metal (commonly Kovar) or ceramic. A common plastic used for this is epoxy-cresol-novolak (ECN). All three material types offer usable mechanical strength, moisture and heat resistance.